Wafer Hybrid Bonding Machine Market Projected to Reach USD 850...

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2026-02-20 13:08:43 - Translate

Wafer Hybrid Bonding Machine Market Projected to Reach USD 850 Million by 2034 Amid 3D IC Surge

Global Wafer Hybrid Bonding Machine market was valued at USD 150 million in 2024 and is forecasted to attain USD 850 million by 2034, registering a CAGR of 26.7% during 2026-2034. This acceleration stems from escalating needs for high-density interconnects in AI accelerators and advanced memory stacks. Wafer hybrid bonding machines execute dielectric-to-dielectric (SiO2) fusion with copper...

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